Flux Paste NoClean for Phone Repair Soldering Solder Tin Cream 559 NC559ASM 28um

Feature: 1. Used in mobile phone PCB, BGA and PGA SMD rework solder paste and low ion system 2. High tin running speed, low smoke emission, and high residual insulation resistance on the surface after curing 3. The high temperature of soldering is easy to oxidize the surface of the soldering material, and the solder paste helps prevent the oxidation process 4. The surface tension of the substance will affect the quality of soldering, another function of the solder paste is to reduce the tension of the material. 5. Small size, easy to carry and store, convenient to use and with good performance Specification: Item Type: FluxFlux Type: NC559ASM Paste Weight: Approx. 100 g 3.5 oz Granularity: 28 (um) Viscosity: 180 (PaS) Soldering Paste: Widely used in clocks and watches, accurate parts, stainless steel crafts, tableware, mobile communications, digital products, air conditioning and refrigerator refrigeration equipment, glasses, knives, car radiators and various PCB boards and BGA solder balls Brazing. Package List: 1 x Flux Note: Please note that the new type and old type of this product will be sent randomly, and make sure you will not mind before ordering. Used in mobile phone PCB, BGA and PGA SMD rework solder paste and low ion system High tin running speed, low smoke emission, and high residual insulation resistance on the surface after curing The high temperature of soldering is easy to oxidize the surface of the soldering material, and the solder paste helps prevent the oxidation process The surface tension of the substance will affect the quality of soldering, another function of the solder paste is to reduce the tension of the material. Small size, easy to carry and store, convenient to use and with good performance